INTERLEAF TECHNOLOGY

From experience in film and MLC capacitors, Paktron determined that many developments could be expected in the field of pre-fabricated dielectrics for electrostatic capacitors.

These developments would include ultra-thin films, high-temperature and flame retardant films, and high K materials. What was needed was a manufacturing system that would cost effectively advance the technology of the day and be compatible with emerging dielectric technology as it became available.

A key consideration in the development was to use proven processes and materials which could be integrated into an easily operated and maintained manufacturing system.

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The Interleaf® Technology Manufacturing System presented here is geared for the manufacturing goals of the 21st century. This system is a major advancement in manufacturing technology that provides an extremely efficient and cost effective alternative to other film capacitor production.

Material Advantages

• No margin metallization. Vacuum plating is simplified by eliminating margin masking.
• Reduced metallized film inventory. Few widths are needed to produce a large variety of sizes.
• Larger film supply rolls. Wider webs and larger rolls provide film at lower cost.
• Smaller precise margins. The ratio of electrified to structural film usage is maximized.
• Aluminum terminals. Similar metal contacts, higher conductivity and lower costs are achieved.
• Lower spray metal usage. Compact sticks in rectangular frames effeciently capture spray metal.
• Higher effective dielectric constant. High temperature/pressure stick cure excludes low K air.
• Capacitor blocks cut to value. Higher yields, tighter distributions and lower material usage are assured.
• Self encasement. Expensive structural material such as boxes and epoxy are not required.
• No hazardous material. Toxic chemicals and Pb spray are eliminated by design.